0807 Bi-Color led
OVERVIEW
0807 Bi-Color led Chip SMD is a surface mount model of two-color LED light source, also known as 2018 SMD led, 0807 Multi-Color led size 2.0 mm × 1.8mm,
bi color has red-green, red-blue, yellow-green, blue Green, blue and yellow, Multi-Color SMD LED: red, green, blue, RGB color combination, suitable for use on circuit boards with limited space.
PERFORMANCE
Table 1 Absolute maximum ratings for QUEENDOM Chip SMD Color Line
Ø Absolute Maximum Rating(At TA=25°C) | Symbol | Ratings | Units |
Parameter | PD | 60 | mW |
Continuous Forward Current | IF | 20 | mA |
Peak Forward Current *1 | IFP | 100 | mA |
Reverse Voltage | VR | 5 | V |
Thermal Resistance Junction To Board | RΘJ-B | / | °C/W |
Operating Temperature Range | TOPR | Minus 30°C To plus 60°C | |
Storage Temperature Range | TSTG | Minus 40°C To plus 80°C | |
Manual Solding Temperature | TSOL | 260°C± 10°C For 3~5 Seconds | |
ESD Sensitivity | ESD | 2000V HBM |
PRODUCT
Table 2 Product performance of QUEENDOM Chip SMD Colors at 20mA, Tj=25º
Specification
Product No. | Emitted Color | Power/W | Wavelenght(nm) | IF(mA) TEST | Φe(MCD/LM) | CRI | VF (V) Typ. | Reverse current | deg 2Ө 1/2 | Lens Type | Part No. |
Qd2018RPGKSA | 12 | 0.06W | 620-630 | 20 | 100-250 | / | 1.8-2.4 | ≤10 | 120 | Clear | 8541401000SL175 |
12 | 0.06W | 520-530 | 20 | 320-800 | / | 2.8-3.7 | ≤10 | 120 | Clear | 8541401000SL176 |
FEATURES
Package form: SMD package-surface mount
Main chips: CREE, Osram, Epistar, Sanan, chip materials such as gallium arsenide (GaAs), sapphire (Al2O3), etc.
Chip range: size 9*9mil -10*16mil (commonly used: 8*8mi 9*9mil 10*10mil)
Packaging wire: High-purity 99.99% gold wire material, such as gold (Au) or copper (Cu) to ensure good conductivity and reliability.
Bracket material: pure gold-plated PCB sheet, pure silver-plated PCB sheet
Packaging glue: silicone + resin glue
Display Index: Available in 70CRI, 80CRI and 90CRI
Lighting method: two-color, RGB, color, etc.
Colloidal color: water clear, yellow, Diffused, Diffused
BENEFITS
Small size, high brightness, low attenuation, instant lighting, long life, multiple colors to choose from
Good color uniformity, colored light adopts 2.5nm binning structure,
Warm white light 200k/PIN, pure white light 500k/PIN, adopted to ensure excellent color uniformity.
Can have built-in IC or external IC, multiple color combinations to choose from
Compatible with reflow soldering, tinned pads improve solderability
bi color | Multi-Color SMD LED packaging structures are available in surface mount, flip chip and side mount welding structures.
APPLICATION
backlit display
Automotive interior
High-end digital
signal indication
smart home
Electronic equipment and communication equipment and other fields.
Instrument light and switch applications
Backlight application, switch signal & signal light source use